Kewu Bai

Person

  • Singapore, SG

Patents Applicationslast 30 patents

  • Information Patent Application

    Method of Forming a Bonded Structure

    • Publication number 20130037603
    • Publication date Feb 14, 2013
    • AGENCY FOR SCIENCE ,TECHNOLOGY AND RESEARCH
    • Won Kyoung Choi
    • H01 - BASIC ELECTRIC ELEMENTS