TREA

Kewu Bai

Follow

Person

  • Singapore, SG
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Lead free tin based solder composition
    • Patent number 6,824,039
    • Issue date Nov 30, 2004
    • Institute of High Performance Computing
    • Ping Wu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead free tin based solder composition
    • Publication number 20030183674
    • Publication date Oct 2, 2003
    • High Performance Computing
    • Ping Wu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead free tin based solder composition
    • Publication number 20030183675
    • Publication date Oct 2, 2003
    • High Performance Computing
    • Ping Wu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR