Khai Huat Jeffrey Low

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,123,526
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a semiconductor device having a resin with wa...
- Patent number 8,377,753
- Issue date Feb 19, 2013
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20150294926
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY