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Khai Huat Jeffrey Low
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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Module comprising a semiconductor chip
Patent number
8,237,268
Issue date
Aug 7, 2012
Infineon Technologies AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic component and a method of fabricating an electronic comp...
Patent number
8,207,601
Issue date
Jun 26, 2012
Infinen Technologies AG
Khai Huat Jeffrey Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having a resin with warpage compensated surfaces
Patent number
8,067,841
Issue date
Nov 29, 2011
Infineon Technologies AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Module Comprising a Semiconductor Chip
Publication number
20120276693
Publication date
Nov 1, 2012
INFINEON TECHNOLOGIES AG
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method of Fabricating A Semiconductor Device Having A Resin With Wa...
Publication number
20120058606
Publication date
Mar 8, 2012
INFINEON TECHNOLOGIES AG
Chai Wei Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component and a Method of Fabricating an Electronic Comp...
Publication number
20090001536
Publication date
Jan 1, 2009
INFINEON TECHNOLOGIES AG
Khai Huat Jeffrey Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module comprising a semiconductor chip
Publication number
20080230928
Publication date
Sep 25, 2008
Ralf Otremba
B81 - MICRO-STRUCTURAL TECHNOLOGY