Khalil Hosseini

Person

Weihmichl, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III heterojunction semiconductor device having silicon carbid...
- Patent number 10,153,276
- Issue date Dec 11, 2018
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement including a ceramic layer
- Patent number 9,984,897
- Issue date May 29, 2018
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and a method of manufacturing the same
- Patent number 9,961,798
- Issue date May 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,790,086
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device assembly including a chip carrier, semiconduct...
- Patent number 9,768,120
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant
- Patent number 9,666,499
- Issue date May 30, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,567,211
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip assembly
- Patent number 9,530,754
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power device and method of fabricating an electronic pow...
- Patent number 9,420,731
- Issue date Aug 16, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,406,646
- Issue date Aug 2, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip device including a substrate
- Patent number 9,385,107
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,379,050
- Issue date Jun 28, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device
- Patent number 9,362,191
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrophoretically depositing a film on an electronic a...
- Patent number 9,313,897
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,275,973
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, wafer arrangement and method of manufacturing the...
- Patent number 9,263,369
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged nano-structured component and method of making a packaged...
- Patent number 9,249,014
- Issue date Feb 2, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package with passives
- Patent number 9,190,389
- Issue date Nov 17, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having an embedded system
- Patent number 9,171,787
- Issue date Oct 27, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic component
- Patent number 9,171,804
- Issue date Oct 27, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20170004979
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20170003180
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20160284661
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Electrophoretically Depositing a Film on an Electronic A...
- Publication number 20160240449
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Device and Method
- Publication number 20160181240
- Publication date Jun 23, 2016
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP ASSEMBLY
- Publication number 20160035700
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20150217994
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Device
- Publication number 20150162287
- Publication date Jun 11, 2015
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20150111343
- Publication date Apr 23, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...
- Publication number 20150076672
- Publication date Mar 19, 2015
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Power Device and Method of Fabricating an Electronic Pow...
- Publication number 20150077941
- Publication date Mar 19, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Encapsulated Semiconductor Device
- Publication number 20150060872
- Publication date Mar 5, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP DEVICE INCLUDING A SUBSTRATE
- Publication number 20150035170
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Ivan NIKITIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Passives
- Publication number 20150028487
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Embedded Passive Component
- Publication number 20150028448
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device
- Publication number 20140353808
- Publication date Dec 4, 2014
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Material to Absorb Thermal Energy
- Publication number 20140312394
- Publication date Oct 23, 2014
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140301039
- Publication date Oct 9, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, WAFER ARRANGEMENT AND METHOD OF MANUFACTURING THE...
- Publication number 20140264919
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140264950
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package
- Publication number 20140246766
- Publication date Sep 4, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package with Separate Inter-Die Interconnects
- Publication number 20140240945
- Publication date Aug 28, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20140239466
- Publication date Aug 28, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140197527
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING AN...
- Publication number 20140151862
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, A SEMICONDUCTOR DIE ARRANGEMENT AND A METHOD FO...
- Publication number 20140138841
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Electronic Component
- Publication number 20140138843
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Khalil Hosseini

Person

Patents Grantslast 30 patents

Circuit package, an electronic circuit package, and methods for enc...

Metallic interconnect, a method of manufacturing a metallic interco...

Group III heterojunction semiconductor device having silicon carbid...

Method for manufacturing a chip arrangement including a ceramic layer

Package and a method of manufacturing the same

Micromechanical semiconductor sensing device

Semiconductor device assembly including a chip carrier, semiconduct...

Electronic device and method for production

Semiconductor device with encapsulant

Micromechanical semiconductor sensing device

Electronic component

Chip package and chip assembly

Electronic power device and method of fabricating an electronic pow...

Electronic device and method for fabricating an electronic device

Chip arrangement, a method for manufacturing a chip arrangement, in...

Multichip device including a substrate

Electronic device

Electronic device and method for production

Electronic device

Encapsulated semiconductor device

Chip arrangement, a method for manufacturing a chip arrangement, in...

Semiconductor device including a polymer disposed on a carrier

Method for electrophoretically depositing a film on an electronic a...

Device including a semiconductor chip and wires

Electronic device and method for fabricating an electronic device

Chip arrangement, wafer arrangement and method of manufacturing the...

Packaged nano-structured component and method of making a packaged...

Chip package with passives

Packaged semiconductor device having an embedded system

Method for fabricating an electronic component

Patents Applicationslast 30 patents

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Micromechanical Semiconductor Sensing Device

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

Method for Electrophoretically Depositing a Film on an Electronic A...

Semiconductor Device and Method

CHIP PACKAGE AND CHIP ASSEMBLY

Micromechanical Semiconductor Sensing Device

Electronic Device

Electronic Component

METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...

Electronic Power Device and Method of Fabricating an Electronic Pow...

Encapsulated Semiconductor Device

MULTICHIP DEVICE INCLUDING A SUBSTRATE

Chip Package with Passives

Chip Package with Embedded Passive Component

Packaged Semiconductor Device

Semiconductor Device Including a Material to Absorb Thermal Energy

PACKAGE AND A METHOD OF MANUFACTURING THE SAME

CHIP ARRANGEMENT, WAFER ARRANGEMENT AND METHOD OF MANUFACTURING THE...

CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT

Semiconductor Chip Package

Multi-Die Package with Separate Inter-Die Interconnects

Electronic Device

Device Including a Semiconductor Chip and Wires

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...

EMBEDDED INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING AN...

INTEGRATED CIRCUIT, A SEMICONDUCTOR DIE ARRANGEMENT AND A METHOD FO...

Method for Fabricating an Electronic Component