Khokan C. PAUL

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed-plasma deposition of thin film layers
- Patent number 12,131,903
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-density substrate processing systems and methods
- Patent number 12,074,042
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing chambers for deposition and etch
- Patent number 11,887,811
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing chambers for deposition and etch
- Patent number 11,699,571
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-density substrate processing systems and methods
- Patent number 11,574,826
- Issue date Feb 7, 2023
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ metrology method for thickness measurement during PECVD pro...
- Patent number 10,527,407
- Issue date Jan 7, 2020
- Applied Materials, Inc.
- Khokan C. Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
On-board metrology (OBM) design and implication in process tool
- Patent number 10,388,549
- Issue date Aug 20, 2019
- Applied Materials, Inc.
- Khokan C. Paul
- G05 - CONTROLLING REGULATING
Information Patent Grant
Deployment of light energy within specific spectral bands in specif...
- Patent number 10,373,823
- Issue date Aug 6, 2019
- Applied Materials, Inc.
- Swaminathan T. Srinivasan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ metrology method for thickness measurement during PECVD pro...
- Patent number 10,281,261
- Issue date May 7, 2019
- Applied Materials, Inc.
- Khokan C. Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL-TO-NOISE CORRECTION METHOD FOR ACCURATE FILMS MEASUREMENT
- Publication number 20250035551
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Khokan C. PAUL
- C30 - CRYSTAL GROWTH
Information Patent Application
Actively Controlled gas inject FOR PROCESS Temperature CONTROL
- Publication number 20250037975
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER KITS, SYSTEMS, AND METHODS FOR CALIBRATING TEMPERATURE SENS...
- Publication number 20250003806
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- C30 - CRYSTAL GROWTH
Information Patent Application
MEASURING SYSTEMS, PROCESSING SYSTEMS, AND RELATED APPARATUS AND ME...
- Publication number 20240363448
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF METROLOGY ON PATTERN WAFER USING REFLECTOMETRY
- Publication number 20240355683
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Khokan C. PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CALIBRATION OF SUBSTRATE PROCESSING CHAMB...
- Publication number 20240258141
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR MONITORING RADIATION OUTPUT OF...
- Publication number 20240234073
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICHROIC MIRROR AND SHORTPASS FILTER FOR IN-SITU REFLECTOMETRY
- Publication number 20240141551
- Publication date May 2, 2024
- Applied Materials, Inc.
- Khokan C. PAUL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU REFLECTOMETRY FOR REAL-TIME PROCESS CONTROL
- Publication number 20240142223
- Publication date May 2, 2024
- Applied Materials, Inc.
- Khokan C. PAUL
- G01 - MEASURING TESTING
Information Patent Application
MULTI-WAVELENGTH PYROMETER FOR CHAMBER MONITORING
- Publication number 20240145273
- Publication date May 2, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPI OVERLAPPING DISK AND RING
- Publication number 20240141487
- Publication date May 2, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR MONITORING RADIATION OUTPUT OF...
- Publication number 20240136140
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROTTLE VALVE AND FORELINE CLEANING USING A MICROWAVE SOURCE
- Publication number 20230390811
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Khokan Chandra Paul
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR DEPOSITION AND ETCH
- Publication number 20230343552
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS
- Publication number 20230170231
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTOR WITH INDUCTIVELY COUPLED PLASMA SOURCE
- Publication number 20230033058
- Publication date Feb 2, 2023
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBER TO ACCOMMODATE PARASITIC PLASMA FO...
- Publication number 20220130713
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER NON-UNIFORMITY TWEAKING THROUGH LOCALIZED ION ENHANCED PLASMA...
- Publication number 20220093368
- Publication date Mar 24, 2022
- Applied Materials, Inc.
- Saketh Pemmasani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE CHAMBER FLOWABLE FILM FORMATION AND TREATMENTS
- Publication number 20220076922
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH
- Publication number 20220076919
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH
- Publication number 20220076920
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED-PLASMA DEPOSITION OF THIN FILM LAYERS
- Publication number 20220044930
- Publication date Feb 10, 2022
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING NON-UNIFORMITY
- Publication number 20210143039
- Publication date May 13, 2021
- Applied Materials, Inc.
- Gautam K. Hemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS
- Publication number 20210013055
- Publication date Jan 14, 2021
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU METROLOGY METHOD FOR THICKNESS MEASUREMENT DURING PECVD PRO...
- Publication number 20190212128
- Publication date Jul 11, 2019
- Applied Materials, Inc.
- Khokan C. PAUL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPLOYMENT OF LIGHT ENERGY WITHIN SPECIFIC SPECTRAL BANDS IN SPECIF...
- Publication number 20180350595
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Swaminathan T. SRINIVASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BOARD METROLOGY (OBM) DESIGN AND IMPLICATION IN PROCESS TOOL
- Publication number 20170148654
- Publication date May 25, 2017
- Applied Materials, Inc.
- Khokan C. PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU METROLOGY METHOD FOR THICKNESS MEASUREMENT DURING PECVD PRO...
- Publication number 20160370173
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Khokan C. PAUL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Khokan C. PAUL

Person

Patents Grantslast 30 patents

Semiconductor processing chamber to accommodate parasitic plasma fo...

Single chamber flowable film formation and treatments

Pulsed-plasma deposition of thin film layers

High-density substrate processing systems and methods

Semiconductor processing chambers for deposition and etch

Semiconductor processing chambers for deposition and etch

High-density substrate processing systems and methods

In-situ metrology method for thickness measurement during PECVD pro...

On-board metrology (OBM) design and implication in process tool

Deployment of light energy within specific spectral bands in specif...

In-situ metrology method for thickness measurement during PECVD pro...

Patents Applicationslast 30 patents

SIGNAL-TO-NOISE CORRECTION METHOD FOR ACCURATE FILMS MEASUREMENT

Actively Controlled gas inject FOR PROCESS Temperature CONTROL

CHAMBER KITS, SYSTEMS, AND METHODS FOR CALIBRATING TEMPERATURE SENS...

MEASURING SYSTEMS, PROCESSING SYSTEMS, AND RELATED APPARATUS AND ME...

METHOD OF METROLOGY ON PATTERN WAFER USING REFLECTOMETRY

METHODS AND APPARATUS FOR CALIBRATION OF SUBSTRATE PROCESSING CHAMB...

METHODS, SYSTEMS, AND APPARATUS FOR MONITORING RADIATION OUTPUT OF...

DICHROIC MIRROR AND SHORTPASS FILTER FOR IN-SITU REFLECTOMETRY

IN-SITU REFLECTOMETRY FOR REAL-TIME PROCESS CONTROL

MULTI-WAVELENGTH PYROMETER FOR CHAMBER MONITORING

EPI OVERLAPPING DISK AND RING

METHODS, SYSTEMS, AND APPARATUS FOR MONITORING RADIATION OUTPUT OF...

THROTTLE VALVE AND FORELINE CLEANING USING A MICROWAVE SOURCE

SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR DEPOSITION AND ETCH

HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS

REACTOR WITH INDUCTIVELY COUPLED PLASMA SOURCE

SEMICONDUCTOR PROCESSING CHAMBER TO ACCOMMODATE PARASITIC PLASMA FO...

WAFER NON-UNIFORMITY TWEAKING THROUGH LOCALIZED ION ENHANCED PLASMA...

SINGLE CHAMBER FLOWABLE FILM FORMATION AND TREATMENTS

SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH

SEMICONDUCTOR PROCESSING CHAMBERS FOR DEPOSITION AND ETCH

PULSED-PLASMA DEPOSITION OF THIN FILM LAYERS

SYSTEMS AND METHODS FOR CONTROLLING NON-UNIFORMITY

HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS

IN-SITU METROLOGY METHOD FOR THICKNESS MEASUREMENT DURING PECVD PRO...

DEPLOYMENT OF LIGHT ENERGY WITHIN SPECIFIC SPECTRAL BANDS IN SPECIF...

ON-BOARD METROLOGY (OBM) DESIGN AND IMPLICATION IN PROCESS TOOL

IN-SITU METROLOGY METHOD FOR THICKNESS MEASUREMENT DURING PECVD PRO...