Ki Bon Cha

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Chungcheiongbuk-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and stacked semiconductor package having the...
- Patent number 8,823,158
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Jae Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked semiconductor package having the...
- Patent number 8,299,591
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Jae Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and fabricating method thereof
- Patent number 7,291,906
- Issue date Nov 6, 2007
- Ki Bon Cha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20130026651
- Publication date Jan 31, 2013
- Hynix Semiconductor Inc.
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20100072598
- Publication date Mar 25, 2010
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Package and Method of Fabricating the Same
- Publication number 20080203552
- Publication date Aug 28, 2008
- UNISEMICON CO., LTD.
- Dong You Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack package and fabricating method thereof
- Publication number 20040150107
- Publication date Aug 5, 2004
- Ki Bon Cha
- H01 - BASIC ELECTRIC ELEMENTS