Ki-Don Lee

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure formed with a high aspect ratio single damas...
- Patent number 10,211,093
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked damascene structures for microelectronic devices
- Patent number 9,431,343
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded polysilicon resistor in integrated circuits formed by a re...
- Patent number 9,240,404
- Issue date Jan 19, 2016
- Texas Instruments Incorporated
- Kwan-Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC resistor formed with integral heatsinking structure
- Patent number 9,111,779
- Issue date Aug 18, 2015
- Texas Instruments Incorporated
- Young-Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded polysilicon resistor in integrated circuits formed by a re...
- Patent number 8,865,542
- Issue date Oct 21, 2014
- Texas Instruments Incorporated
- Kwan-Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically inactive via for electromigration reliability improvement
- Patent number 7,566,652
- Issue date Jul 28, 2009
- Texas Instruments Incorporated
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple copper vias for integrated circuit metallization
- Patent number 7,078,817
- Issue date Jul 18, 2006
- Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical cooling fin for interconnects
- Patent number 7,031,163
- Issue date Apr 18, 2006
- Texas Instruments Incorporated
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple copper vias for integrated circuit metallization and metho...
- Patent number 6,919,639
- Issue date Jul 19, 2005
- The Board of Regents, The University of Texas System
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE FORMED WITH A HIGH ASPECT RATIO SINGLE DAMAS...
- Publication number 20180012796
- Publication date Jan 11, 2018
- Samsung Electronics Co., Ltd.
- Ki-Don LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DAMASCENE STRUCTURES FOR MICROELECTRONIC DEVICES
- Publication number 20160268199
- Publication date Sep 15, 2016
- Ki-Don LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED POLYSILICON RESISTOR IN INTEGRATED CIRCUITS FORMED BY A RE...
- Publication number 20150008531
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Kwan-Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Polysilicon Resistor in Integrated Circuits Formed by a Re...
- Publication number 20140183657
- Publication date Jul 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Kwan-Yong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC RESISTOR FORMED WITH INTEGRAL HEATSINKING STRUCTURE
- Publication number 20100032770
- Publication date Feb 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Young-Joon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically inactive via for electromigration reliability improvement
- Publication number 20080017989
- Publication date Jan 24, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple copper vias for integrated circuit metallization
- Publication number 20050093163
- Publication date May 5, 2005
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanical cooling fin for interconnects
- Publication number 20040125572
- Publication date Jul 1, 2004
- Ki-Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple copper vias for integrated circuit metallization and metho...
- Publication number 20040070078
- Publication date Apr 15, 2004
- Paul S. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Interconnect structure formed with a high aspect ratio single damas...

Stacked damascene structures for microelectronic devices

Embedded polysilicon resistor in integrated circuits formed by a re...

IC resistor formed with integral heatsinking structure

Embedded polysilicon resistor in integrated circuits formed by a re...

Electrically inactive via for electromigration reliability improvement

Multiple copper vias for integrated circuit metallization

Mechanical cooling fin for interconnects

Multiple copper vias for integrated circuit metallization and metho...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE FORMED WITH A HIGH ASPECT RATIO SINGLE DAMAS...

STACKED DAMASCENE STRUCTURES FOR MICROELECTRONIC DEVICES

EMBEDDED POLYSILICON RESISTOR IN INTEGRATED CIRCUITS FORMED BY A RE...

Embedded Polysilicon Resistor in Integrated Circuits Formed by a Re...

IC RESISTOR FORMED WITH INTEGRAL HEATSINKING STRUCTURE

Electrically inactive via for electromigration reliability improvement

Multiple copper vias for integrated circuit metallization

Mechanical cooling fin for interconnects

Multiple copper vias for integrated circuit metallization and metho...