Ki Il Moon

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having EMI shielding parts and methods of fa...
- Patent number 9,842,809
- Issue date Dec 12, 2017
- SK hynix Inc.
- Ki Ill Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a step type substrate
- Patent number 9,515,052
- Issue date Dec 6, 2016
- SK hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,184,155
- Issue date Nov 10, 2015
- SK Hynix Inc.
- Ki Il Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 9,030,009
- Issue date May 12, 2015
- SK Hynix Inc.
- Ki Il Moon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES
- Publication number 20250022869
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT P...
- Publication number 20190027378
- Publication date Jan 24, 2019
- SK HYNIX INC.
- Myeong Seob KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT P...
- Publication number 20170053813
- Publication date Feb 23, 2017
- SK HYNIX INC.
- Myeong Seob KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING PARTS AND METHODS OF FA...
- Publication number 20170047293
- Publication date Feb 16, 2017
- SK HYNIX INC.
- Ki Ill MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STEP TYPE SUBSTRATE
- Publication number 20160379961
- Publication date Dec 29, 2016
- SK HYNIX INC.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYST...
- Publication number 20160118337
- Publication date Apr 28, 2016
- SK HYNIX INC.
- Sang Hoon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160013161
- Publication date Jan 14, 2016
- SK HYNIX INC.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140361426
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140353847
- Publication date Dec 4, 2014
- SK HYNIX INC.
- Ki Il Moon
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor packages having EMI shielding parts and methods of fa...

Semiconductor package including a step type substrate

Semiconductor package

Stacked semiconductor package and method for manufacturing the same

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT P...

METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT P...

SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING PARTS AND METHODS OF FA...

SEMICONDUCTOR PACKAGE INCLUDING A STEP TYPE SUBSTRATE

EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYST...

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE