Ki Joo SIM

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with improved signal stability and method of...
- Patent number 10,163,746
- Issue date Dec 25, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong In Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided package module and substrate strip
- Patent number 10,109,595
- Issue date Oct 23, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED PACKAGE MODULE AND SUBSTRATE STRIP
- Publication number 20170221835
- Publication date Aug 3, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160315027
- Publication date Oct 27, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jong In RYU
- H01 - BASIC ELECTRIC ELEMENTS