Ki Wook Lee

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to nested filters
- Patent number 11,765,814
- Issue date Sep 19, 2023
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,527,819
- Issue date Dec 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making printed circuit board structure including a closed...
- Patent number 11,445,620
- Issue date Sep 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a radio-frequency module with a conformal s...
- Patent number 11,069,978
- Issue date Jul 20, 2021
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making printed circuit board structure including a closed...
- Patent number 10,986,739
- Issue date Apr 20, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 10,700,424
- Issue date Jun 30, 2020
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGE WITH INTERCONNECT POSTS WITH PLATED SOLDER CAPS
- Publication number 20240363509
- Publication date Oct 31, 2024
- Skyworks Solutions, Inc.
- Yi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS
- Publication number 20240321791
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
- Publication number 20240297130
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED FILTERS
- Publication number 20240090123
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING METAL POSTS
- Publication number 20240087999
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Chien Jen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD
- Publication number 20230402294
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...
- Publication number 20230402338
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMB...
- Publication number 20230402293
- Publication date Dec 14, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY
- Publication number 20230187820
- Publication date Jun 15, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Method for Manufacturing an Electronic Package
- Publication number 20230115846
- Publication date Apr 13, 2023
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING
- Publication number 20220310530
- Publication date Sep 29, 2022
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
- Publication number 20210399423
- Publication date Dec 23, 2021
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...
- Publication number 20210315110
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20210315109
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY
- Publication number 20200395659
- Publication date Dec 17, 2020
- SKYWORKS SOLUTIONS, INC.
- Ki Wook Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS RELATED TO NESTED FILTERS
- Publication number 20200077510
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Robert Francis DARVEAUX
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...
- Publication number 20180324960
- Publication date Nov 8, 2018
- SKYWORKS SOLUTIONS, INC.
- Ki Wook Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY
- Publication number 20180323502
- Publication date Nov 8, 2018
- SKYWORKS SOLUTIONS, INC.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA
- Publication number 20180294558
- Publication date Oct 11, 2018
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A RADIO-FREQUENCY MODULE WITH A CONFORMAL S...
- Publication number 20180294568
- Publication date Oct 11, 2018
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc Vu Hoang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RADIO-FREQUENCY MODULE WITH INTEGRATED SHIELD LAYER ANTENNA AND INT...
- Publication number 20180294569
- Publication date Oct 11, 2018
- SKYWORKS SOLUTIONS, INC.
- Dinhphuoc Vu Hoang
- H01 - BASIC ELECTRIC ELEMENTS

Ki Wook Lee

Person

Patents Grantslast 30 patents

Application of conductive via or trench for intra module EMI shielding

Printed circuit board structure including a closed cavity

Devices and methods related to nested filters

Method of making a closed cavity printed circuit board with pattern...

Printed circuit board structure including a closed cavity

Method of making printed circuit board structure including a closed...

Method of manufacturing a radio-frequency module with a conformal s...

Method of making printed circuit board structure including a closed...

Printed circuit board structure including a closed cavity

Patents Applicationslast 30 patents

MOLDED PACKAGE WITH INTERCONNECT POSTS WITH PLATED SOLDER CAPS

SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

NESTED FILTERS

PACKAGING SUBSTRATE HAVING METAL POSTS

METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD

ELECTRONIC PACKAGE WITH THROUGH-MOLD CONNECTIONS AND RELATED ELECTR...

METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMB...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY

Electronic Package and Method for Manufacturing an Electronic Package

APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING

RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA

METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY

DEVICES AND METHODS RELATED TO NESTED FILTERS

METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...

PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY

RADIO-FREQUENCY MODULE WITH INTEGRATED CONFORMAL SHIELD ANTENNA

METHOD OF MANUFACTURING A RADIO-FREQUENCY MODULE WITH A CONFORMAL S...

RADIO-FREQUENCY MODULE WITH INTEGRATED SHIELD LAYER ANTENNA AND INT...