Kiah Ling Tan

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package assembly with improved bond wire separation
- Patent number 9,431,364
- Issue date Aug 30, 2016
- Cypess Semiconductor Corporation
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Package Assembly with Improved Bond Wire Separation
- Publication number 20140191417
- Publication date Jul 10, 2014
- SPANSION LLC
- Kiah Ling Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE
- Publication number 20080318364
- Publication date Dec 25, 2008
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS