Kianush Naeli

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Corvallis, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-wafer pair anodic bonding apparatus and method
- Patent number 9,287,126
- Issue date Mar 15, 2016
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
- Publication number 20140322892
- Publication date Oct 30, 2014
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- C03 - GLASS MINERAL OR SLAG WOOL