Kie Ueda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of packaging electronic parts
- Patent number 6,589,802
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Toyoki Asada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RFID tag and manufacturing method thereof
- Publication number 20070007344
- Publication date Jan 11, 2007
- Kosuke Inoue
- G06 - COMPUTING CALCULATING COUNTING