Kiichi Kawabata

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition
- Patent number 9,593,240
- Issue date Mar 14, 2017
- JNC Corporation
- Akio Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition
- Patent number 9,512,273
- Issue date Dec 6, 2016
- JNC Corporation
- Akio Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organosilicon compound, thermosetting resin composition containing...
- Patent number 9,115,243
- Issue date Aug 25, 2015
- JNC Corporation
- Kiichi Kawabata
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Compound including organopolysiloxane or silsesquioxane skeleton ha...
- Patent number 8,987,358
- Issue date Mar 24, 2015
- JNC Corporation
- Kiichi Kawabata
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Organic silicon compound, thermosetting composition containing said...
- Patent number 8,952,108
- Issue date Feb 10, 2015
- JNC Corporation
- Daisuke Inoki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organosilicon compound, thermosetting resin composition containing...
- Patent number 8,946,357
- Issue date Feb 3, 2015
- JNC Corporation
- Kiichi Kawabata
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polymerizable terminal group-containing polyorganosiloxane and prod...
- Patent number 6,310,169
- Issue date Oct 30, 2001
- Chisso Corporation
- Kiichi Kawabata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY,...
- Publication number 20220025123
- Publication date Jan 27, 2022
- JNC CORPORATION
- Hironori IKENO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION
- Publication number 20160264779
- Publication date Sep 15, 2016
- JNC CORPORATION
- AKIO TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION
- Publication number 20150291737
- Publication date Oct 15, 2015
- JNC CORPORATION
- Akio Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAIN...
- Publication number 20150065643
- Publication date Mar 5, 2015
- JNC CORPORATION
- KIICHI KAWABATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOUND INCLUDING ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HA...
- Publication number 20140148536
- Publication date May 29, 2014
- JNC CORPORATION
- Kiichi Kawabata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAIN...
- Publication number 20130096249
- Publication date Apr 18, 2013
- JNC CORPORATION
- Kiichi Kawabata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID...
- Publication number 20120149819
- Publication date Jun 14, 2012
- Daisuke Inoki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kiichi Kawabata

Person

Patents Grantslast 30 patents

Thermosetting resin composition

Thermosetting resin composition

Organosilicon compound, thermosetting resin composition containing...

Compound including organopolysiloxane or silsesquioxane skeleton ha...

Organic silicon compound, thermosetting composition containing said...

Organosilicon compound, thermosetting resin composition containing...

Polymerizable terminal group-containing polyorganosiloxane and prod...

Patents Applicationslast 30 patents

CONDENSATION-CURABLE RESIN COMPOSITION, CURED PRODUCT, MOLDED BODY,...

THERMOSETTING RESIN COMPOSITION

THERMOSETTING RESIN COMPOSITION

NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAIN...

COMPOUND INCLUDING ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HA...

NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAIN...

ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID...