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Kijoo Hong
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Seoul, KR
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last 30 patents
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Patent Grant
Thickness estimation method and processing control method
Patent number
11,668,558
Issue date
Jun 6, 2023
Samsung Electronics Co., Ltd.
Jongsu Kim
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
WAFER PROCESSING APPARATUS
Publication number
20230207356
Publication date
Jun 29, 2023
Samsung Electronics Co., Ltd.
Seungbeom PARK
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
METHOD OF INSPECTING A WAFER AND APPARATUS FOR PERFORMING THE SAME
Publication number
20230104399
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Juntaek Oh
G01 - MEASURING TESTING
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Patent Application
THICKNESS ESTIMATION METHOD AND PROCESSING CONTROL METHOD
Publication number
20220065618
Publication date
Mar 3, 2022
Samsung Electronics Co., Ltd.
Jongsu Kim
G06 - COMPUTING CALCULATING COUNTING