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Kikuji Fukai
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for supplying chip parts
Patent number
6,371,276
Issue date
Apr 16, 2002
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Electronic component supply apparatus
Patent number
6,264,061
Issue date
Jul 24, 2001
Taiyo Yuden Co., Ltd.
Kikuji Fukai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for supplying electronic components
Patent number
6,250,455
Issue date
Jun 26, 2001
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Electronic component placing apparatus
Patent number
6,195,876
Issue date
Mar 6, 2001
Taiyo Yuden Co., Ltd.
Kazushige Koyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for supplying chip parts
Patent number
6,102,188
Issue date
Aug 15, 2000
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Apparatus for supplying chip parts and a method for same
Patent number
5,836,437
Issue date
Nov 17, 1998
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Apparatus for supplying chip parts and a method for same
Patent number
5,636,725
Issue date
Jun 10, 1997
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Atomizer for forming a thin film
Patent number
5,114,076
Issue date
May 19, 1992
Taiyo Yuden Co., Ltd.
Mizuho Imai
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Chip mounting apparatus
Patent number
4,914,809
Issue date
Apr 10, 1990
Taiyo Yuden Co., Ltd.
Kikuji Fukai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of and apparatus for mounting chips
Patent number
4,868,979
Issue date
Sep 26, 1989
Taiyo Yuden Co., Ltd.
Hiroshi Fukushima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mist supplying device for forming thin film
Patent number
4,783,006
Issue date
Nov 8, 1988
President of Kogyo Gijutuin
Yutaka Hayashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Apparatus for transporting electronic components or the like from o...
Patent number
4,352,440
Issue date
Oct 5, 1982
Taiyo Yuden Co., Ltd.
Kikuji Fukai
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
Information
Patent Application
Method and apparatus for supplying chip parts
Publication number
20010020567
Publication date
Sep 13, 2001
Taiyo Yuden Co., Ltd.
Koji Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL