Kim Hwee Tan

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Jiangyin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Device having wire bond and redistribution layer
- Patent number 8,058,712
- Issue date Nov 15, 2011
- Semiconductor Components Industries, LLC
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond and redistribution layer process
- Patent number 7,541,251
- Issue date Jun 2, 2009
- California Micro Devices
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE HAVING WIRE BOND AND REDISTRIBUTION LAYER
- Publication number 20110204495
- Publication date Aug 25, 2011
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bond and redistribution layer process
- Publication number 20070187765
- Publication date Aug 16, 2007
- Mitchell M. Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS