Kim Liu

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KunShan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising dielectric structures with different p...
- Patent number 11,116,075
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
- Publication number 20220078923
- Publication date Mar 10, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Having Component Covered With Ultra-Thin Transiti...
- Publication number 20210227702
- Publication date Jul 22, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising Dielectric Structures With Different P...
- Publication number 20200281071
- Publication date Sep 3, 2020
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS