Kimberley A. Kelly

Person

Pleasant Valley, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a lamination and surface planarization for multila...
- Patent number 6,632,314
- Issue date Oct 14, 2003
- International Business Machines Corporation
- RongQing Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of top-surface-metallurgy plate-up bonding and rewiring for...
- Patent number 6,455,331
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,448,169
- Issue date Sep 10, 2002
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
One step method for curing and joining BGA solder balls
- Patent number 6,333,209
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Column for module component
- Patent number 6,331,731
- Issue date Dec 18, 2001
- International Business Machines Corporation
- Kimberley Anne Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,248,599
- Issue date Jun 19, 2001
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for transferring a thin-film structure to a substrate
- Patent number 6,183,588
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Kimberley A. Kelly
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,149,048
- Issue date Nov 21, 2000
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for transferring a thin-film structure to a temporary carrier
- Patent number 6,143,117
- Issue date Nov 7, 2000
- International Business Machines Corporation
- Kimberley A. Kelly
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for providing solder interconnections to semiconductor an...
- Patent number 6,099,935
- Issue date Aug 8, 2000
- International Business Machines Corporation
- William Brearley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,048,741
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for releasing a thin-film structure from a substrate
- Patent number 6,036,809
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Kimberley A. Kelly
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ball grid array by partitioned lamination process
- Patent number 5,735,452
- Issue date Apr 7, 1998
- International Business Machines Corporation
- Roy Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bottom-surface-metallurgy rework process in ceramic modules
- Patent number 5,722,579
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH MEMORY DENSITY, HIGH INPUT/OUTPUT BANDWIDTH LOGIC-MEMORY STRUC...
- Publication number 20120233510
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Evan G. Colgan
- G11 - INFORMATION STORAGE
Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of top-surface-metallurgy plate-up bonding and rewiring for...
- Publication number 20010023081
- Publication date Sep 20, 2001
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

Kimberley A. Kelly

Person

Patents Grantslast 30 patents

Process for forming a multi-level thin-film electronic packaging st...

Method of making a lamination and surface planarization for multila...

Process of top-surface-metallurgy plate-up bonding and rewiring for...

Apparatus and method for use in manufacturing semiconductor devices

One step method for curing and joining BGA solder balls

Column for module component

Multi-level thin-film electronic packaging structure and related me...

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Process for transferring a thin-film structure to a substrate

Apparatus and method for use in manufacturing semiconductor devices

Process for transferring a thin-film structure to a temporary carrier

Apparatus for providing solder interconnections to semiconductor an...

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Process for releasing a thin-film structure from a substrate

Ball grid array by partitioned lamination process

Bottom-surface-metallurgy rework process in ceramic modules

Patents Applicationslast 30 patents

HIGH MEMORY DENSITY, HIGH INPUT/OUTPUT BANDWIDTH LOGIC-MEMORY STRUC...

Process for forming a multi-level thin-film electronic packaging st...

Process of top-surface-metallurgy plate-up bonding and rewiring for...