Kimi S. Husse

Person

  • Keller, TX, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Method for packaging an electronic circuit device

    • Patent number 5,161,304
    • Issue date Nov 10, 1992
    • SGS-Thomson Microelectronics, Inc.
    • Daniel Queyssac
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Zero power IC module

    • Patent number 5,089,877
    • Issue date Feb 18, 1992
    • SGS-Thomson Microelectronics, Inc.
    • Daniel Queyssac
    • H01 - BASIC ELECTRIC ELEMENTS