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Kimi S. Husse
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Keller, TX, US
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last 30 patents
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Patent Grant
Method for packaging an electronic circuit device
Patent number
5,161,304
Issue date
Nov 10, 1992
SGS-Thomson Microelectronics, Inc.
Daniel Queyssac
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Zero power IC module
Patent number
5,089,877
Issue date
Feb 18, 1992
SGS-Thomson Microelectronics, Inc.
Daniel Queyssac
H01 - BASIC ELECTRIC ELEMENTS