Kimihiko KUBO

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe and leadframe package
- Patent number 11,088,056
- Issue date Aug 10, 2021
- Ryota Furuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for manufacturing same
- Patent number 9,824,960
- Issue date Nov 21, 2017
- Mitsui High-Tec, Inc.
- Takahiro Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL COMPONENT
- Publication number 20240243045
- Publication date Jul 18, 2024
- MITSUI HIGH-TEC, INC.
- Kimihiko KUBO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL COMPONENT
- Publication number 20230047332
- Publication date Feb 16, 2023
- MITSUI HIGH-TEC, INC.
- Kimihiko KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPONENT
- Publication number 20220285252
- Publication date Sep 8, 2022
- MITSUI HIGH-TEC, INC.
- Kento KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND LEADFRAME PACKAGE
- Publication number 20200135628
- Publication date Apr 30, 2020
- MITSUI HIGH-TEC, INC.
- Ryota FURUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING SAME
- Publication number 20180040543
- Publication date Feb 8, 2018
- MITSUI HIGH-TEC, INC.
- Takahiro ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING SAME
- Publication number 20170025329
- Publication date Jan 26, 2017
- MITSUI HIGH-TEC, INC.
- Takahiro ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS