Kimihiro YAMANAKA

Person

Yasu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module and optical wiring board
- Patent number 9,110,234
- Issue date Aug 18, 2015
- Kyocera Corporation
- Kenji Terada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and mounting structure
- Patent number 8,446,734
- Issue date May 21, 2013
- Kyocera Corporation
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and structure using the same
- Patent number 8,350,161
- Issue date Jan 8, 2013
- Kycera Corporation
- Kimihiro Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,284,557
- Issue date Oct 9, 2012
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and structure using the same
- Patent number 8,253,027
- Issue date Aug 28, 2012
- Kyocera Corporation
- Kimihiro Yamanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 7,084,355
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Yoshiyuki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic package using same
- Patent number 6,985,362
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array module and method of manufacturing same
- Patent number 6,667,559
- Issue date Dec 23, 2003
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole structure and printed circuit board including the thro...
- Patent number 6,486,414
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Kaoru Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making substrate member having electrical lines and apert...
- Patent number 5,517,756
- Issue date May 21, 1996
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate member having electric lines and apertured insulating film
- Patent number 5,252,781
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Masaharu Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE AND OPTICAL WIRING BOARD
- Publication number 20130272648
- Publication date Oct 17, 2013
- KYOCERA CORPORATION
- Kenji Terada
- G02 - OPTICS
Information Patent Application
Circuit Board and Mounting Structure
- Publication number 20100259910
- Publication date Oct 14, 2010
- KYOCERA CORPORATION
- Katsura Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20100254098
- Publication date Oct 7, 2010
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Structure Using the Same
- Publication number 20100212947
- Publication date Aug 26, 2010
- Kyocera Corporation
- Kimihiro YAMANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Structure Using the Same
- Publication number 20100193231
- Publication date Aug 5, 2010
- Kyocera Corporation
- Kimihiro YAMANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board And Method Of Manufacturing Same
- Publication number 20080164057
- Publication date Jul 10, 2008
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOLE DRILLING METHOD AND APPARATUS
- Publication number 20040164060
- Publication date Aug 26, 2004
- International Business Machines Corporation
- Yoji Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed circuit board
- Publication number 20030214797
- Publication date Nov 20, 2003
- International Business Machines Corporation
- Yoshiyuki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array module and method of manufacturing same
- Publication number 20020187585
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Yutaka Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-hole structure and printed circuit board including the thro...
- Publication number 20020027020
- Publication date Mar 7, 2002
- International Business Machines Corporation
- Kaoru Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and electronic package using same
- Publication number 20020007964
- Publication date Jan 24, 2002
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS

Kimihiro YAMANAKA

Person

Patents Grantslast 30 patents

Optical module and optical wiring board

Circuit board and mounting structure

Circuit board and structure using the same

Circuit board, mounting structure, and method for manufacturing cir...

Circuit board and structure using the same

Multilayer printed circuit board

Printed circuit board and electronic package using same

Ball grid array module and method of manufacturing same

Through-hole structure and printed circuit board including the thro...

Method of making substrate member having electrical lines and apert...

Substrate member having electric lines and apertured insulating film

Patents Applicationslast 30 patents

OPTICAL MODULE AND OPTICAL WIRING BOARD

Circuit Board and Mounting Structure

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

Circuit Board and Structure Using the Same

Circuit Board and Structure Using the Same

Printed Wiring Board And Method Of Manufacturing Same

HOLE DRILLING METHOD AND APPARATUS

Multilayer printed circuit board

Ball grid array module and method of manufacturing same

Through-hole structure and printed circuit board including the thro...

Printed circuit board and electronic package using same