Kimiji Nishimaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Inspection method of bonded status of ball in wire bonding
- Patent number 7,899,239
- Issue date Mar 1, 2011
- Kaijo Corporation
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of measuring thickness of bonded ball in wire bonding
- Patent number 7,191,929
- Issue date Mar 20, 2007
- Kaijo Corporation
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and wire bonding method
- Patent number 5,566,876
- Issue date Oct 22, 1996
- Kaijo Corporation
- Kimiji Nishimaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder and wire bonding method
- Patent number 5,474,224
- Issue date Dec 12, 1995
- Kaijo Corporation
- Kimiji Nishimaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder and wire bonding method
- Patent number 5,458,280
- Issue date Oct 17, 1995
- Kaijo Corporation
- Kimiji Nishimaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder and wire bonding method
- Patent number 5,456,403
- Issue date Oct 10, 1995
- Kaijo Corporation
- Kimiji Nishimaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Inspection method of bonded status of ball in wire bonding
- Publication number 20060079008
- Publication date Apr 13, 2006
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of measuring thickness of bonded ball in wire bonding
- Publication number 20060054662
- Publication date Mar 16, 2006
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR