Kimitaka Nishio

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Chiba-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package production method and semiconductor package
- Patent number 6,969,919
- Issue date Nov 29, 2005
- Texas Instruments Incorporated
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a thermoset bond
- Patent number 6,774,496
- Issue date Aug 10, 2004
- Texas Instruments Incorporated
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package
- Patent number 6,716,674
- Issue date Apr 6, 2004
- Texas Instruments Incorporated
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package production method and semiconductor package
- Publication number 20050003577
- Publication date Jan 6, 2005
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package production method and semiconductor package
- Publication number 20030153121
- Publication date Aug 14, 2003
- TEXAS INSTRUMENTS INCORPORATED
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package production method and semiconductor package
- Publication number 20030049883
- Publication date Mar 13, 2003
- Kiyoshi Yajima
- H01 - BASIC ELECTRIC ELEMENTS