Kin Fung YU

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Atomization mechanism for cooling a bond head
- Patent number 10,312,214
- Issue date Jun 4, 2019
- ASM Technology Singapore Pte. Ltd.
- Yi Kei Law
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pick arm comprising a winged part for a bonding apparatus
- Patent number 10,192,761
- Issue date Jan 29, 2019
- ASM Technology Singapore Pte. Ltd.
- Kin Fung Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIZATION MECHANISM FOR COOLING A BOND HEAD
- Publication number 20180068973
- Publication date Mar 8, 2018
- ASM Technology Singapore Pte Ltd
- Yi Kei LAW
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PICK ARM COMPRISING A WINGED PART FOR A BONDING APPARATUS
- Publication number 20170238449
- Publication date Aug 17, 2017
- ASM Technology Singapore Pte Ltd
- Kin Fung YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR