Kin-Weng Wang

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Zhudong Town, TW

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Patents Grantslast 30 patents

Information Patent Grant
Post etch dielectric film re-capping layer
- Patent number 8,105,947
- Issue date Jan 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shwang-Ming Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Post Etch Dielectric Film Re-Capping Layer
- Publication number 20100120253
- Publication date May 13, 2010
- Shwang-Ming Jeng
- H01 - BASIC ELECTRIC ELEMENTS