Kin Yik HUNG

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond head for thermal compression die bonding
- Patent number 9,281,290
- Issue date Mar 8, 2016
- ASM Technology Singapore Pte. Ltd.
- Kin Yik Hung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for generating amplified cooling air flows
- Patent number 7,667,355
- Issue date Feb 23, 2010
- ASM Assembly Automation LTD
- Yuk Cheung Au
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD FOR THERMAL COMPRESSION DIE BONDING
- Publication number 20140027068
- Publication date Jan 30, 2014
- Kin Yik HUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
FLIP ARM MODULE FOR A BONDING APPARATUS INCORPORATING CHANGEABLE CO...
- Publication number 20120279660
- Publication date Nov 8, 2012
- ASM Technology Singapore Pte Ltd
- Chi Fung CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR GENERATING AMPLIFIED COOLING AIR FLOWS
- Publication number 20090195088
- Publication date Aug 6, 2009
- Yuk Cheung AU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER