Kin Yik Hung

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Flip arm module for a bonding apparatus incorporating changeable co...
- Patent number 8,857,486
- Issue date Oct 14, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Fung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducer assembly
- Patent number 7,002,283
- Issue date Feb 21, 2006
- ASM Assembly Automation LTD
- Hing Leung Marchy Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrasonic transducer assembly
- Publication number 20040245893
- Publication date Dec 9, 2004
- ASM Assembly Automation Ltd
- Hing Leung Marchy Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for application of adhesive substances to objects
- Publication number 20040003891
- Publication date Jan 8, 2004
- ASM Assembly Automation Ltd
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR