King Hoo Ong

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-uniform vacuum profile die attach tip
- Patent number 9,038,264
- Issue date May 26, 2015
- SanDisk Semiconductor (Shanghai) Co., Ltd.
- Pradeep Kumar Rai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for separating a diced semiconductor die from a die attach tape
- Patent number 8,499,813
- Issue date Aug 6, 2013
- SanDisk Technologies Inc.
- Jack Chang Chien
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for reclaiming semiconductor package
- Patent number 7,745,234
- Issue date Jun 29, 2010
- SanDisk Corporation
- King Hoo Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS