King-Lung Wu

Person

Tainan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating node contacts
- Patent number 6,667,234
- Issue date Dec 23, 2003
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating bitlines
- Patent number 6,531,395
- Issue date Mar 11, 2003
- United Microelectronics Corp.
- Alex Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming landing pad
- Patent number 6,479,355
- Issue date Nov 12, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a lower storage node of a capacitor
- Patent number 6,432,772
- Issue date Aug 13, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of automatically defining a landing via
- Patent number 6,429,106
- Issue date Aug 6, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a bottom electrode
- Patent number 6,417,065
- Issue date Jul 9, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming inner-cylindrical capacitor without top electrod...
- Patent number 6,413,832
- Issue date Jul 2, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing dynamic random access memory cell
- Patent number 6,329,244
- Issue date Dec 11, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a capacitor in dram
- Patent number 6,326,276
- Issue date Dec 4, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a bottom electrode
- Patent number 6,316,352
- Issue date Nov 13, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a bottom electrode
- Patent number 6,312,985
- Issue date Nov 6, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for a buried bit line
- Patent number 6,277,717
- Issue date Aug 21, 2001
- United Microelectronics Corp.
- Chuan-Fu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating node contact hole
- Patent number 6,207,581
- Issue date Mar 27, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a narrow bit line structure
- Patent number 6,197,630
- Issue date Mar 6, 2001
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dual cylindrical capacitor
- Patent number 6,165,865
- Issue date Dec 26, 2000
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a data-storage capacitor for a dynamic random...
- Patent number 6,162,670
- Issue date Dec 19, 2000
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a capacitor in a dynamic random access memory
- Patent number 6,121,108
- Issue date Sep 19, 2000
- United Microelectroincs Corp.
- Chuan-Fu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electrode structure for a cylindrical cap...
- Patent number 6,110,835
- Issue date Aug 29, 2000
- United Microelectronics Corp.
- Chuan-Fu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing DRAM capacitor
- Patent number 6,080,619
- Issue date Jun 27, 2000
- United Microelectronics Corp.
- Sun-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dual cylindrical capacitor
- Patent number 6,074,911
- Issue date Jun 13, 2000
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating dual cylindrical capacitor
- Patent number 6,060,401
- Issue date May 9, 2000
- United Microelectronics Corp.
- Jung-Chao Chiou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating node contacts
- Publication number 20020115291
- Publication date Aug 22, 2002
- United Microelectronics Corp., No. 3
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming landing pad
- Publication number 20020111006
- Publication date Aug 15, 2002
- United Microelectronics Corp.,
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for treating the surface of a bit line conductive layer
- Publication number 20020110978
- Publication date Aug 15, 2002
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a contact plug without a dimple surface
- Publication number 20020111011
- Publication date Aug 15, 2002
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF AUTOMATICALLY DEFINING A LANDING VIA
- Publication number 20020098687
- Publication date Jul 25, 2002
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INNER-CYLINDRICAL CAPACITOR WITHOUT TOP ELECTROD...
- Publication number 20020090792
- Publication date Jul 11, 2002
- United Microelectronics Corp.
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a cylinder capacitor having a reverse electro...
- Publication number 20020072190
- Publication date Jun 13, 2002
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STORAGE NODE OF A CAPACITOR
- Publication number 20020064956
- Publication date May 30, 2002
- King-Lung Wu
- H01 - BASIC ELECTRIC ELEMENTS

King-Lung Wu

Person

Patents Grantslast 30 patents

Method of fabricating node contacts

Method for fabricating bitlines

Method for forming landing pad

Method of forming a lower storage node of a capacitor

Method of automatically defining a landing via

Method of fabricating a bottom electrode

Method for forming inner-cylindrical capacitor without top electrod...

Method of manufacturing dynamic random access memory cell

Method for forming a capacitor in dram

Method of fabricating a bottom electrode

Method of fabricating a bottom electrode

Fabrication method for a buried bit line

Method of fabricating node contact hole

Method of fabricating a narrow bit line structure

Method of fabricating dual cylindrical capacitor

Method of fabricating a data-storage capacitor for a dynamic random...

Method for fabricating a capacitor in a dynamic random access memory

Method for fabricating an electrode structure for a cylindrical cap...

Method for manufacturing DRAM capacitor

Method of fabricating dual cylindrical capacitor

Method of fabricating dual cylindrical capacitor

Patents Applicationslast 30 patents

Method of fabricating node contacts

Method for forming landing pad

Method for treating the surface of a bit line conductive layer

Method for forming a contact plug without a dimple surface

METHOD OF AUTOMATICALLY DEFINING A LANDING VIA

METHOD FOR FORMING INNER-CYLINDRICAL CAPACITOR WITHOUT TOP ELECTROD...

Method of fabricating a cylinder capacitor having a reverse electro...

METHOD OF FORMING A STORAGE NODE OF A CAPACITOR