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Kwai Chung, HK
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Patents Grants
last 30 patents
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Patent Grant
Direct die attach utilizing heated bond head
Patent number
7,854,365
Issue date
Dec 21, 2010
ASM Assembly Automation LTD
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
Publication number
20100105172
Publication date
Apr 29, 2010
Ming LI
H01 - BASIC ELECTRIC ELEMENTS