King Yi Heung

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing system with local area rate control and oscillation mode
- Patent number 10,610,994
- Issue date Apr 7, 2020
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textured small pad for chemical mechanical polishing
- Patent number 10,589,399
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Selection of polishing parameters to generate removal or pressure p...
- Patent number 10,493,590
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Local area polishing system and polishing pad assemblies for a poli...
- Patent number 10,434,623
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing automated recipe generation
- Patent number 10,256,111
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- Eric Lau
- G01 - MEASURING TESTING
Information Patent Grant
Selection of polishing parameters to generate removal or pressure p...
- Patent number 9,213,340
- Issue date Dec 15, 2015
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Selection of polishing parameters to generate removal profile
- Patent number 8,774,958
- Issue date Jul 8, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20200282506
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...
- Publication number 20180250788
- Publication date Sep 6, 2018
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION
- Publication number 20180005842
- Publication date Jan 4, 2018
- Applied Materials, Inc.
- Eric LAU
- G01 - MEASURING TESTING
Information Patent Application
POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE
- Publication number 20170274495
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...
- Publication number 20170274497
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
TEXTURED SMALL PAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170274498
- Publication date Sep 28, 2017
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20160096251
- Publication date Apr 7, 2016
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20140277670
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE
- Publication number 20120277897
- Publication date Nov 1, 2012
- Huanbo Zhang
- G05 - CONTROLLING REGULATING

King Yi Heung

Person

Patents Grantslast 30 patents

Polishing system with local area rate control and oscillation mode

Textured small pad for chemical mechanical polishing

Selection of polishing parameters to generate removal or pressure p...

Local area polishing system and polishing pad assemblies for a poli...

Chemical mechanical polishing automated recipe generation

Selection of polishing parameters to generate removal or pressure p...

Selection of polishing parameters to generate removal profile

Patents Applicationslast 30 patents

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC P...

CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION

POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE

LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...

TEXTURED SMALL PAD FOR CHEMICAL MECHANICAL POLISHING

Selection of Polishing Parameters to Generate Removal or Pressure P...

Selection of Polishing Parameters to Generate Removal or Pressure P...

SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE