Kinji Nagata

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump forming method
- Patent number 7,807,560
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered wiring substrate including wiring layers and insulatin...
- Patent number 7,696,613
- Issue date Apr 13, 2010
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP FORMING METHOD
- Publication number 20090023281
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered wiring substrate and method of manufacturing the same
- Publication number 20070057363
- Publication date Mar 15, 2007
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR