Kinuko Mishiro

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making assembly module and board module and electronic ap...
- Patent number 7,835,159
- Issue date Nov 16, 2010
- Fujitsu Limited
- Kinuko Mishiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting substrate and structure
- Patent number 7,321,099
- Issue date Jan 22, 2008
- Fujitsu Limited
- Kinuko Mishiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a connecting structure of printed wiring bo...
- Patent number 5,799,392
- Issue date Sep 1, 1998
- Fujitsu Limited
- Kinuko Mishiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SOLDERING METHOD
- Publication number 20160254241
- Publication date Sep 1, 2016
- Fujitsu Limited
- Yoshinobu MAENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT B...
- Publication number 20110188214
- Publication date Aug 4, 2011
- Fujitsu Limited
- Kinuko MISHIRO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making assembly module and board module and electronic ap...
- Publication number 20080101048
- Publication date May 1, 2008
- FUJITSU LIMITED
- Kinuko Mishiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for reducing warp of substrate
- Publication number 20070063324
- Publication date Mar 22, 2007
- FUJITSU LIMITED
- Kinuko Mishiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component mounting substrate and structure
- Publication number 20050224252
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Kinuko Mishiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kinuko Mishiro

Person

Patents Grantslast 30 patents

Substrate on which electronic component is soldered, electronic dev...

Method of making assembly module and board module and electronic ap...

Component mounting substrate and structure

Method of manufacturing a connecting structure of printed wiring bo...

Patents Applicationslast 30 patents

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

PRINTED CIRCUIT BOARD AND SOLDERING METHOD

METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT B...

Method of making assembly module and board module and electronic ap...

Structure and method for reducing warp of substrate

Component mounting substrate and structure