Kinya Fujino

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Patent number 7,056,770
- Issue date Jun 6, 2006
- Towa Corporation
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Resin Sealing/Molding Apparatus
- Publication number 20090162467
- Publication date Jun 25, 2009
- Hiroshi Uragami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Publication number 20040101631
- Publication date May 27, 2004
- TOWA CORPORATION
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS