Kinya GOTO

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
- Patent number 9,368,459
- Issue date Jun 14, 2016
- ACACIA RESEARCH GROUP LLC
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
- Patent number 8,963,291
- Issue date Feb 24, 2015
- Renesas Electronics Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,390,135
- Issue date Mar 5, 2013
- Renesas Electronics Corporation
- Yoshihiro Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
- Patent number 8,018,030
- Issue date Sep 13, 2011
- Renesas Electronics Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,981,790
- Issue date Jul 19, 2011
- Renesas Electronics Corporation
- Teruhiko Kumada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,960,279
- Issue date Jun 14, 2011
- Renesas Electronics Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,671,473
- Issue date Mar 2, 2010
- Renesas Technology Corp.
- Teruhiko Kumada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with seal ring
- Patent number 7,605,448
- Issue date Oct 20, 2009
- Renesas Technology Corp.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,602,063
- Issue date Oct 13, 2009
- Renesas Technology Corp.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a dual damascene contact in an insulating fi...
- Patent number 7,208,408
- Issue date Apr 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device includes an insulating film having density or car...
- Patent number 6,930,394
- Issue date Aug 16, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,737,319
- Issue date May 18, 2004
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and MIM-type capacitor formed in different la...
- Patent number 6,734,489
- Issue date May 11, 2004
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing a stack of dielectric layers including a fluori...
- Patent number 6,551,921
- Issue date Apr 22, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,509,648
- Issue date Jan 21, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing contact structure
- Patent number 6,399,424
- Issue date Jun 4, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,222,256
- Issue date Apr 24, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN
- Publication number 20150108613
- Publication date Apr 23, 2015
- RENESAS ELECTRONICS CORPORATION
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110298133
- Publication date Dec 8, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN
- Publication number 20110215447
- Publication date Sep 8, 2011
- Renesas Electronics Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20100112805
- Publication date May 6, 2010
- Renesas Technology Corp.
- Teruhiko Kumada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090263963
- Publication date Oct 22, 2009
- Renesas Technology Corp.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING
- Publication number 20090189245
- Publication date Jul 30, 2009
- Renesas Technology Corporation
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device and semiconductor device
- Publication number 20080093709
- Publication date Apr 24, 2008
- RENESAS TECHNOLOGY CORP.
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070114668
- Publication date May 24, 2007
- Renesas Technology Corp.
- Kinya Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20060286814
- Publication date Dec 21, 2006
- Renesas Technology Corp.
- Teruhiko Kumada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20060175705
- Publication date Aug 10, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Makoto Tsutsue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060055005
- Publication date Mar 16, 2006
- Renesas Technology Corporation
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060006530
- Publication date Jan 12, 2006
- Renesas Technology Corp.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for fabricating the same
- Publication number 20050263857
- Publication date Dec 1, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for fabricating the same
- Publication number 20040089924
- Publication date May 13, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20030068880
- Publication date Apr 10, 2003
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device comprising MIM-type capacitor and method of ma...
- Publication number 20020179955
- Publication date Dec 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20010021557
- Publication date Sep 13, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor chip with seal ring and sacrificial corner pattern

Semiconductor chip with seal ring and sacrificial corner pattern

Semiconductor device

Semiconductor chip with seal ring and sacrificial corner pattern

Semiconductor device and method of fabricating the same

Semiconductor device and manufacturing method therefor

Semiconductor device and method of fabricating the same

Semiconductor device with seal ring

Semiconductor device and manufacturing method therefor

Method for fabricating a dual damascene contact in an insulating fi...

Electronic device includes an insulating film having density or car...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor element and MIM-type capacitor formed in different la...

Method of polishing a stack of dielectric layers including a fluori...

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing contact structure

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH SEAL RING

Manufacturing method of semiconductor device and semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device and method of fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device

Semiconductor device and manufacturing method therefor

Electronic device and method for fabricating the same

Electronic device and method for fabricating the same

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device comprising MIM-type capacitor and method of ma...

Semiconductor device and method of manufacturing the same