Kinya Sugie

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number RE38588
- Issue date Sep 14, 2004
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Lead material for electronic part, lead and semiconductor device us...
- Patent number 6,110,608
- Issue date Aug 29, 2000
- The Furukawa Electric Co., Ltd.
- Morimasa Tanimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC WIRE
- Publication number 20140008097
- Publication date Jan 9, 2014
- KYOWA ELECTRIC WIRE CO., LTD.
- Kinya SUGIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING STRUCTURE AND METHOD FOR MANUFACTURING ELECTRIC MATERIAL
- Publication number 20110012497
- Publication date Jan 20, 2011
- KYOWA ELECTRIC WIRE CO., LTD.
- Yoshinori Sumiya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR