Kiranjit Dhaliwal

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid cabling solution for higher bandwidth and millimeter wave ap...
- Patent number 11,670,435
- Issue date Jun 6, 2023
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CABLING SOLUTION FOR HIGHER BANDWIDTH AND MILLIMETER WAVE AP...
- Publication number 20230260674
- Publication date Aug 17, 2023
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CABLING SOLUTION FOR HIGHER BANDWIDTH AND MILLIMETER WAVE AP...
- Publication number 20220328212
- Publication date Oct 13, 2022
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS