Kirill Trunov

Person

Duisburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch soldering of different elements in power module
- Patent number 11,798,924
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering preform with varying surface profile
- Patent number 11,764,185
- Issue date Sep 19, 2023
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch diffusion soldering and electronic devices produced by batch...
- Patent number 11,158,602
- Issue date Oct 26, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for producing a semiconductor chip and m...
- Patent number 9,741,639
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Frank Umbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including diffusion soldered layer on sintered...
- Patent number 8,736,052
- Issue date May 27, 2014
- Infineon Technologies AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20240047439
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
- Publication number 20230065738
- Publication date Mar 2, 2023
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20210391310
- Publication date Dec 16, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...
- Publication number 20210375824
- Publication date Dec 2, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Diffusion Soldering and Electronic Devices Produced by Batch...
- Publication number 20210143123
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND M...
- Publication number 20140077376
- Publication date Mar 20, 2014
- Frank Umbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...
- Publication number 20130049204
- Publication date Feb 28, 2013
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS

Kirill Trunov

Person

Patents Grantslast 30 patents

Semiconductor device having a soldered joint with one or more inter...

Batch soldering of different elements in power module

Diffusion soldering preform with varying surface profile

Preform diffusion soldering

Batch diffusion soldering and electronic devices produced by batch...

Semiconductor chip, method for producing a semiconductor chip and m...

Semiconductor device including diffusion soldered layer on sintered...

Patents Applicationslast 30 patents

Batch Soldering of Different Elements in Power Module

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE

Batch Soldering of Different Elements in Power Module

ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...

Preform Diffusion Soldering

Batch Diffusion Soldering and Electronic Devices Produced by Batch...

SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND M...

SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...