Kirk J. Strozewski

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Round Rock, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a multiple thickness interconnect
- Patent number 7,176,574
- Issue date Feb 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method for making small features
- Patent number 6,858,542
- Issue date Feb 22, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a passivation layer for air gap formation
- Patent number 6,838,354
- Issue date Jan 4, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor interconnect with multiple thick...
- Patent number 6,815,820
- Issue date Nov 9, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having a multiple thickness interconnect
- Publication number 20050035459
- Publication date Feb 17, 2005
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor fabrication method for making small features
- Publication number 20040142576
- Publication date Jul 22, 2004
- Terry G. Sparks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a passivation layer for air gap formation and st...
- Publication number 20040119134
- Publication date Jun 24, 2004
- Cindy K. Goldberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple thickness semiconductor interconnect and method therefor
- Publication number 20030209779
- Publication date Nov 13, 2003
- Kathleen C. Yu
- H01 - BASIC ELECTRIC ELEMENTS