Kishore N. Renjan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Built-in connector for board-to-board and flex-to-rigid board conne...
- Patent number 12,095,185
- Issue date Sep 17, 2024
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-mounted components
- Patent number 12,028,982
- Issue date Jul 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric-mounted components
- Patent number 11,864,322
- Issue date Jan 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging technologies for temperature sensing in health care products
- Patent number 11,817,383
- Issue date Nov 14, 2023
- Apple Inc.
- Pierpaolo Lupo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded packaging concepts for integration of ASICs and optical co...
- Patent number 11,651,976
- Issue date May 16, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-mounted components
- Patent number 11,576,262
- Issue date Feb 7, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniaturization of optical sensor modules through wirebonded ball s...
- Patent number 11,552,053
- Issue date Jan 10, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- G02 - OPTICS
Information Patent Grant
Packaging technologies for temperature sensing in health care products
- Patent number 11,313,741
- Issue date Apr 26, 2022
- Apple Inc.
- Pierpaolo Lupo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Invisible compartment shielding
- Patent number 10,037,948
- Issue date Jul 31, 2018
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
- Publication number 20240107249
- Publication date Mar 28, 2024
- Apple Inc.
- Kyusang KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Fabric-Mounted Components
- Publication number 20240032203
- Publication date Jan 25, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20230386865
- Publication date Nov 30, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Increased Volumetric and Functional Efficiencies o...
- Publication number 20230213715
- Publication date Jul 6, 2023
- Apple Inc.
- Scott D. Morrison
- G02 - OPTICS
Information Patent Application
Fabric-Mounted Components
- Publication number 20230189445
- Publication date Jun 15, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...
- Publication number 20230089258
- Publication date Mar 23, 2023
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES
- Publication number 20230078536
- Publication date Mar 16, 2023
- Apple Inc.
- Ali N. Ergun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Connections and Button Interconnects for Molded SiPs
- Publication number 20230056922
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Right Angle Sidewall and Button Interconnects for Molded SiPs
- Publication number 20230055647
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging Technologies for Temperature Sensing in Health Care Products
- Publication number 20220270955
- Publication date Aug 25, 2022
- Apple Inc.
- Pierpaolo Lupo
- G01 - MEASURING TESTING
Information Patent Application
Miniaturization of Optical Sensor Modules through Wirebonded Ball S...
- Publication number 20210405313
- Publication date Dec 30, 2021
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- G02 - OPTICS
Information Patent Application
Fabric-Mounted Components
- Publication number 20210337671
- Publication date Oct 28, 2021
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging Technologies for Temperature Sensing in Health Care Products
- Publication number 20210181039
- Publication date Jun 17, 2021
- Apple Inc.
- Pierpaolo Lupo
- G01 - MEASURING TESTING
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20210090908
- Publication date Mar 25, 2021
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVISIBLE COMPARTMENT SHIELDING
- Publication number 20180053731
- Publication date Feb 22, 2018
- Apple Inc.
- Phillip R. Sommer
- H01 - BASIC ELECTRIC ELEMENTS

Kishore N. Renjan

Person

Patents Grantslast 30 patents

Built-in connector for board-to-board and flex-to-rigid board conne...

Fabric-mounted components

Fabric-mounted components

Packaging technologies for temperature sensing in health care products

Right angle sidewall and button interconnects for molded SiPs

Embedded packaging concepts for integration of ASICs and optical co...

Fabric-mounted components

Miniaturization of optical sensor modules through wirebonded ball s...

Packaging technologies for temperature sensing in health care products

Invisible compartment shielding

Patents Applicationslast 30 patents

MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY

Fabric-Mounted Components

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

Technologies for Increased Volumetric and Functional Efficiencies o...

Fabric-Mounted Components

Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...

CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES

Sidewall Connections and Button Interconnects for Molded SiPs

Right Angle Sidewall and Button Interconnects for Molded SiPs

Packaging Technologies for Temperature Sensing in Health Care Products

Miniaturization of Optical Sensor Modules through Wirebonded Ball S...

Fabric-Mounted Components

Packaging Technologies for Temperature Sensing in Health Care Products

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

INVISIBLE COMPARTMENT SHIELDING