Kisup Chung

Person

Slingerlands, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal cut patterning and etching to minimize interlayer dielectric...
- Patent number 11,990,342
- Issue date May 21, 2024
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning magnetic tunnel junctions and the like while reducing de...
- Patent number 11,476,415
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,276,767
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,152,489
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cut patterning and etching to minimize interlayer dielectric...
- Patent number 11,133,189
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,075,281
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient metal-insulator-metal capacitor
- Patent number 10,978,550
- Issue date Apr 13, 2021
- Tessera, Inc.
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for forming MRAM device
- Patent number 10,748,962
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cut patterning and etching to minimize interlayer dielectric...
- Patent number 10,734,234
- Issue date Aug 4, 2020
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,714,683
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MTJ stack etch using IBE to achieve vertical profile
- Patent number 10,693,059
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,680,169
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient metal-insulator-metal capacitor
- Patent number 10,651,266
- Issue date May 12, 2020
- Tessera, Inc.
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 10,600,884
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient metal-insulator-metal capacitor fabrication
- Patent number 10,256,289
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor (FET) with a gate having a recessed work fu...
- Patent number 10,217,839
- Issue date Feb 26, 2019
- GLOBALFOUNDRIES Inc.
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient metal-insulator-metal capacitor
- Patent number 10,090,378
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wimpy and nominal semiconductor device structures for vertical finFETs
- Patent number 9,881,842
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlled recessing of materials in cavities in IC devices
- Patent number 9,589,850
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...
- Publication number 20230006131
- Publication date Jan 5, 2023
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...
- Publication number 20220005698
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT METAL-INSULATOR-METAL CAPACITOR
- Publication number 20200273947
- Publication date Aug 27, 2020
- Tessera, Inc.
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...
- Publication number 20200176673
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES
- Publication number 20200144491
- Publication date May 7, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20200083350
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20200083349
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES
- Publication number 20190386210
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Structure For Forming MRAM Device
- Publication number 20190326354
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MTJ STACK ETCH USING IBE TO ACHIEVE VERTICAL PROFILE
- Publication number 20190259939
- Publication date Aug 22, 2019
- International Business Machines Corporation
- SOON-CHEON SEO
- G11 - INFORMATION STORAGE
Information Patent Application
METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...
- Publication number 20190198327
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...
- Publication number 20190189452
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT METAL-INSULATOR-METAL CAPACITOR
- Publication number 20180350896
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR (FET) WITH A GATE HAVING A RECESSED WORK FU...
- Publication number 20180277652
- Publication date Sep 27, 2018
- GLOBALFOUNDRIES INC.
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT METAL-INSULATOR-METAL CAPACITOR
- Publication number 20180269271
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20180269305
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20180269306
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT METAL-INSULATOR-METAL CAPACITOR FABRICATION
- Publication number 20180269274
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Kisup Chung
- H01 - BASIC ELECTRIC ELEMENTS

Kisup Chung

Person

Patents Grantslast 30 patents

Metal cut patterning and etching to minimize interlayer dielectric...

Patterning magnetic tunnel junctions and the like while reducing de...

Additive core subtractive liner for metal cut etch processes

Additive core subtractive liner for metal cut etch processes

Metal cut patterning and etching to minimize interlayer dielectric...

Additive core subtractive liner for metal cut etch processes

Efficient metal-insulator-metal capacitor

Method and structure for forming MRAM device

Metal cut patterning and etching to minimize interlayer dielectric...

Multilayer hardmask for high performance MRAM devices

MTJ stack etch using IBE to achieve vertical profile

Multilayer hardmask for high performance MRAM devices

Efficient metal-insulator-metal capacitor

Additive core subtractive liner for metal cut etch processes

Efficient metal-insulator-metal capacitor fabrication

Field effect transistor (FET) with a gate having a recessed work fu...

Efficient metal-insulator-metal capacitor

Wimpy and nominal semiconductor device structures for vertical finFETs

Method for controlled recessing of materials in cavities in IC devices

Patents Applicationslast 30 patents

PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...

METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...

EFFICIENT METAL-INSULATOR-METAL CAPACITOR

PATTERNING MAGNETIC TUNNEL JUNCTIONS AND THE LIKE WHILE REDUCING DE...

MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES

Method And Structure For Forming MRAM Device

MTJ STACK ETCH USING IBE TO ACHIEVE VERTICAL PROFILE

METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...

METAL CUT PATTERNING AND ETCHING TO MINIMIZE INTERLAYER DIELECTRIC...

EFFICIENT METAL-INSULATOR-METAL CAPACITOR

FIELD EFFECT TRANSISTOR (FET) WITH A GATE HAVING A RECESSED WORK FU...

EFFICIENT METAL-INSULATOR-METAL CAPACITOR

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

EFFICIENT METAL-INSULATOR-METAL CAPACITOR FABRICATION