Kitaek Kang

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
In situ, ex situ and inline process monitoring, optimization and fa...
- Patent number 7,816,152
- Issue date Oct 19, 2010
- WaferMaster, Inc
- Woo Sik Yoo
- G01 - MEASURING TESTING
Information Patent Grant
Focused laser beam processing
- Patent number 7,718,554
- Issue date May 18, 2010
- WaferMasters, Inc.
- Woo Sik Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical emission spectroscopy process monitoring and material chara...
- Patent number 7,599,048
- Issue date Oct 6, 2009
- WaferMasters, Inc.
- Woo Sik Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High pressure treatment for improved grain growth and void reduction
- Patent number 7,344,979
- Issue date Mar 18, 2008
- WaferMasters, Inc.
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light beam conditioner
- Patent number 7,262,918
- Issue date Aug 28, 2007
- WaferMasters Incorporated
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer mapping apparatus and method
- Patent number 6,636,626
- Issue date Oct 21, 2003
- WaferMasters, Inc.
- Woo Sik Yoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for converting analog data to digital data
- Patent number 6,621,943
- Issue date Sep 16, 2003
- WaferMasters, Inc.
- Woo Sik Yoo
- G01 - MEASURING TESTING
Information Patent Grant
Method for determining robot alignment
- Patent number 6,591,161
- Issue date Jul 8, 2003
- WaferMasters, Inc.
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer alignment system and method
- Patent number 6,516,244
- Issue date Feb 4, 2003
- WaferMasters, Inc.
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
In Situ, Ex Situ and Inline Process Monitoring, Optimization and Fa...
- Publication number 20080254553
- Publication date Oct 16, 2008
- Woo Sik Yoo
- G01 - MEASURING TESTING
Information Patent Application
Selective Depth Optical Processing
- Publication number 20080206897
- Publication date Aug 28, 2008
- Woo Sik Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOCUSED LASER BEAM PROCESSING
- Publication number 20080191121
- Publication date Aug 14, 2008
- Woo Sik Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Emission Spectroscopy Process Monitoring and Material Chara...
- Publication number 20080192250
- Publication date Aug 14, 2008
- Woo Sik Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMIC WAFER STRESS MANAGEMENT SYSTEM
- Publication number 20070146685
- Publication date Jun 28, 2007
- Woo Sik Yoo
- G01 - MEASURING TESTING
Information Patent Application
High pressure treatment for improved grain growth and void reduction
- Publication number 20060183326
- Publication date Aug 17, 2006
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for determining robot alignment
- Publication number 20020103571
- Publication date Aug 1, 2002
- Woo Sik Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Kitaek Kang

Person

Patents Grantslast 30 patents

In situ, ex situ and inline process monitoring, optimization and fa...

Focused laser beam processing

Optical emission spectroscopy process monitoring and material chara...

High pressure treatment for improved grain growth and void reduction

Light beam conditioner

Wafer mapping apparatus and method

System and method for converting analog data to digital data

Method for determining robot alignment

Wafer alignment system and method

Patents Applicationslast 30 patents

In Situ, Ex Situ and Inline Process Monitoring, Optimization and Fa...

Selective Depth Optical Processing

FOCUSED LASER BEAM PROCESSING

Optical Emission Spectroscopy Process Monitoring and Material Chara...

DYNAMIC WAFER STRESS MANAGEMENT SYSTEM

High pressure treatment for improved grain growth and void reduction

System and method for determining robot alignment