KIWON BAEK

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with balanced wiring structure
- Patent number 12,362,313
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for noise prevention and semiconductor package including...
- Patent number 12,322,687
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 12,040,278
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 11,791,325
- Issue date Oct 17, 2023
- Samsung Electronics Co, Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240332198
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM
- Publication number 20240014113
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420414
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALANCED WIRING STRUCTURE
- Publication number 20230009850
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Kiwon BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR NOISE PREVENTION AND SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20220392833
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- KIWON BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220384351
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- KIWON BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20220028848
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- KIWON BAEK
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package with balanced wiring structure

Substrate for noise prevention and semiconductor package including...

Semiconductor device and semiconductor package including the same

Semiconductor package including interposer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSORS AND ELECTRONIC SYSTEM

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH BALANCED WIRING STRUCTURE

SUBSTRATE FOR NOISE PREVENTION AND SEMICONDUCTOR PACKAGE INCLUDING...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER