Kiyoaki HASHIMOTO

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Ishikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package to reduce warping
- Patent number 10,090,276
- Issue date Oct 2, 2018
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 9,786,611
- Issue date Oct 10, 2017
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,418,944
- Issue date Aug 16, 2016
- J-DEVICES CORPORATION
- Kiyoaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160351511
- Publication date Dec 1, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160172265
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150371915
- Publication date Dec 24, 2015
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS