Kiyoaki IIda

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging apparatus and electronic packaging method
- Patent number 8,720,519
- Issue date May 13, 2014
- Shinko Electric Industries Co., Ltd.
- Takatoyo Yamakami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate manufacturing method
- Patent number 8,671,561
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus having a movable conductive ball...
- Patent number 8,299,628
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting method and surplus ball removing apparatus
- Patent number 8,141,770
- Issue date Mar 27, 2012
- Shinko Electric Industries Co., Ltd.
- Fumio Sunohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus and conductive ball mounting method
- Patent number 7,900,807
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor ball mounting apparatus, conductor ball mounting method,...
- Patent number 7,866,534
- Issue date Jan 11, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball removing method, conductive ball mounting method, c...
- Patent number 7,866,533
- Issue date Jan 11, 2011
- Shinko Electric Industries Co., Ltd.
- Kazuo Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for arranging magnetic solder balls
- Patent number 7,854,367
- Issue date Dec 21, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting conductive ball and conductive ball mounting app...
- Patent number 7,854,366
- Issue date Dec 21, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting method and apparatus having a movable sold...
- Patent number 7,829,451
- Issue date Nov 9, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for arranging magnetic solder balls
- Patent number 7,784,671
- Issue date Aug 31, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball mounting apparatus and conductive ball mounting method
- Patent number 7,703,662
- Issue date Apr 27, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of mounting conductive ball
- Patent number 7,597,233
- Issue date Oct 6, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD
- Publication number 20120043005
- Publication date Feb 23, 2012
- Shinko Electric Industries Co., Ltd.
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20110023292
- Publication date Feb 3, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS
- Publication number 20100270364
- Publication date Oct 28, 2010
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20100230469
- Publication date Sep 16, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL REMOVING METHOD, CONDUCTIVE BALL MOUNTING METHOD, C...
- Publication number 20090159646
- Publication date Jun 25, 2009
- Shinko Electric Industries Co., Ltd.
- Kazuo Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND SURPLUS BALL REMOVING APPARATUS
- Publication number 20090159651
- Publication date Jun 25, 2009
- SHINKO ELECTRIC INDUSTIRES CO., LTD
- Fumio SUNOHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS
- Publication number 20090072012
- Publication date Mar 19, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL AND CONDUCTIVE BALL MOUNTING APP...
- Publication number 20090072011
- Publication date Mar 19, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki SAKAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20090026247
- Publication date Jan 29, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20090023282
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR BALL MOUNTING APPARATUS, CONDUCTOR BALL MOUNTING METHOD,...
- Publication number 20090008433
- Publication date Jan 8, 2009
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING METHOD AND APPARATUS
- Publication number 20080301935
- Publication date Dec 11, 2008
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Kiyoaki IIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD
- Publication number 20080217386
- Publication date Sep 11, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoaki IIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kiyoaki IIda

Person

Patents Grantslast 30 patents

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Chip embedded substrate and method of producing the same

Chip embedded substrate and method of producing the same

Electronic packaging apparatus and electronic packaging method

Substrate manufacturing method

Conductive ball mounting apparatus having a movable conductive ball...

Conductive ball mounting method and surplus ball removing apparatus

Chip embedded substrate and method of producing the same

Conductive ball mounting apparatus and conductive ball mounting method

Conductor ball mounting apparatus, conductor ball mounting method,...

Conductive ball removing method, conductive ball mounting method, c...

Apparatus and method for arranging magnetic solder balls

Method of mounting conductive ball and conductive ball mounting app...

Conductive ball mounting method and apparatus having a movable sold...

Apparatus and method for arranging magnetic solder balls

Conductive ball mounting apparatus and conductive ball mounting method

Apparatus and method of mounting conductive ball

Patents Applicationslast 30 patents

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS

APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD

CONDUCTIVE BALL REMOVING METHOD, CONDUCTIVE BALL MOUNTING METHOD, C...

CONDUCTIVE BALL MOUNTING METHOD AND SURPLUS BALL REMOVING APPARATUS

APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS

METHOD OF MOUNTING CONDUCTIVE BALL AND CONDUCTIVE BALL MOUNTING APP...

APPARATUS AND METHOD OF MOUNTING CONDUCTIVE BALL

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS

CONDUCTOR BALL MOUNTING APPARATUS, CONDUCTOR BALL MOUNTING METHOD,...

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

SUBSTRATE MANUFACTURING METHOD AND APPARATUS

CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD