Kiyoaki Kadoi

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Chiba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 7,750,443
- Issue date Jul 6, 2010
- Seiko Instruments Inc.
- Kiyoaki Kadoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump electrode
- Patent number 6,563,216
- Issue date May 13, 2003
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit and manufacturing method therefore
- Patent number 6,492,692
- Issue date Dec 10, 2002
- Seiko Instruments Inc.
- Kazutoshi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dicing and assembling method
- Patent number 6,022,792
- Issue date Feb 8, 2000
- Seiko Instruments, Inc.
- Kazutoshi Ishii
- H01 - BASIC ELECTRIC ELEMENTS