Kiyoaki Tsumura

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor laser device, and optical pickup apparatus using the...
- Patent number 6,907,053
- Issue date Jun 14, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Ohgiyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for melting a bump by induction heating
- Patent number 6,288,376
- Issue date Sep 11, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number RE35496
- Issue date Apr 29, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- 174 - Electricity: conductors and insulators
Information Patent Grant
Process of passivating a semiconductor device bonding pad by immers...
- Patent number 5,565,378
- Issue date Oct 15, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,334,803
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Ken Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting structure including lead frame and le...
- Patent number 5,293,066
- Issue date Mar 8, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a copper wires ball bonded to aluminum el...
- Patent number 5,229,646
- Issue date Jul 20, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of ball bonding to non-wire bonded electrodes of semiconduct...
- Patent number 5,124,277
- Issue date Jun 23, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing semiconductor device
- Patent number 5,116,783
- Issue date May 26, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 5,093,712
- Issue date Mar 3, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire ball bonding
- Patent number 5,023,697
- Issue date Jun 11, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of electrode junction for semiconductor device
- Patent number 5,003,373
- Issue date Mar 26, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 4,984,056
- Issue date Jan 8, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hitoshi Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary tip for bonding a wire
- Patent number 4,886,200
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding a wire and bonding apparatus
- Patent number 4,821,944
- Issue date Apr 18, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoaki Tsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor laser device, and optical pickup apparatus using the...
- Publication number 20030123499
- Publication date Jul 3, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Ohgiyama
- G11 - INFORMATION STORAGE

Kiyoaki Tsumura

Person

Patents Grantslast 30 patents

Semiconductor laser device, and optical pickup apparatus using the...

Method and apparatus for melting a bump by induction heating

Semiconductor device and method of producing the same

Process of passivating a semiconductor device bonding pad by immers...

Semiconductor device and method of producing the same

Semiconductor device mounting structure including lead frame and le...

Semiconductor device with a copper wires ball bonded to aluminum el...

Method of ball bonding to non-wire bonded electrodes of semiconduct...

Method of producing semiconductor device

Resin-sealed semiconductor device

Semiconductor device with copper wire ball bonding

Structure of electrode junction for semiconductor device

Semiconductor integrated circuit device

Capillary tip for bonding a wire

Method for bonding a wire and bonding apparatus

Patents Applicationslast 30 patents

Semiconductor laser device, and optical pickup apparatus using the...