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Kiyoshi Adachi

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  • Hiratsuka-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate connector
    • Patent number 8,460,011
    • Issue date Jun 11, 2013
    • Molex Incorporated
    • Kiyoshi Adachi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate connector
    • Patent number 8,235,730
    • Issue date Aug 7, 2012
    • Molex Incorporated
    • Kiyoshi Adachi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket for semiconductor package
    • Patent number 7,275,938
    • Issue date Oct 2, 2007
    • Molex Incorporated
    • Tomohiro Nakano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket and contact of semiconductor package
    • Patent number 7,021,944
    • Issue date Apr 4, 2006
    • Molex Incorporated
    • Kiyoshi Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Socket and contact of semiconductor package
    • Patent number 6,981,881
    • Issue date Jan 3, 2006
    • Molex Incorporated
    • Kiyoshi Adachi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    IC socket
    • Patent number 6,471,524
    • Issue date Oct 29, 2002
    • Molex Incorporated
    • Tomohiro Nakano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,690,281
    • Issue date Nov 25, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE CONNECTOR
    • Publication number 20120276790
    • Publication date Nov 1, 2012
    • Molex Incorporated
    • Kiyoshi Adachi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Substrate Connector
    • Publication number 20100173506
    • Publication date Jul 8, 2010
    • Molex Incorporated
    • Kiyoshi Adachi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Socket and contact of semiconductor package
    • Publication number 20050070134
    • Publication date Mar 31, 2005
    • Kiyoshi Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Socket and contact of semiconductor package
    • Publication number 20050070135
    • Publication date Mar 31, 2005
    • Kiyoshi Adachi
    • G01 - MEASURING TESTING
  • Information Patent Application

    Socket for semiconductor package
    • Publication number 20040063241
    • Publication date Apr 1, 2004
    • Tomohiro Nakano
    • G01 - MEASURING TESTING